The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Jul. 02, 2018
Applicant:

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Qiyao Wang, Sunnyvale, CA (US);

Susumu Serita, San Jose, CA (US);

Chetan Gupta, San Mateo, CA (US);

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/406 (2006.01);
U.S. Cl.
CPC ...
G05B 19/406 (2013.01); G05B 2219/32222 (2013.01);
Abstract

Example implementations described herein are directed to systems and methods for defect rate analytics to reduce defectiveness in manufacturing. In an example implementation, a method include determining, from data associated with each feature for a manufacturing process, the data feature indicative of process defects detected based on the feature, an estimated condition for the feature that reduces a defect rate of the process defects, the estimated condition indicating the data into a first group and second group; calculating the rate reduction of the defect rate based on a difference in defects between the first group and the second group; for the rate reduction meeting a target confidence level for a target defect rate, applying the estimated condition to the manufacturing process associated with each of the features. In example implementations, the defect rate analytics reduce defectiveness in manufacturing with independent processes and/or dependent processes.


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