The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Jun. 28, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Ali Afzali-Ardakani, Ossining, NY (US);
Abram L. Falk, Port Chester, NY (US);
Bharat Kumar, Tarrytown, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 33/84 (2006.01); G01N 27/414 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); G01N 33/487 (2006.01);
U.S. Cl.
CPC ...
G01N 27/414 (2013.01); G01N 27/4146 (2013.01); G01N 33/48714 (2013.01); G01N 33/84 (2013.01); H01L 29/0669 (2013.01); H01L 29/66477 (2013.01); G01N 2610/00 (2013.01); G01N 2800/28 (2013.01);
Abstract
Embodiments of the invention are directed to a solid-state zinc sensor. A non-limiting example of the sensor includes a semiconductor substrate. The sensor can also include an assembly surface on the semiconductor substrate. The sensor can also include a zinc detection monolayer chemically bound to the assembly surface. The sensor can also include a power supply electrically connected to the semiconductor substrate.