The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Jul. 08, 2016
Applicant:

Ngk Spark Plug Co., Ltd., Nagoya-shi, Aichi, JP;

Inventors:

Tatsunori Yamada, Seto, JP;

Shunsuke Tsuga, Niwa-gun, JP;

Yusuke Fuji, Nagoya, JP;

Junki Iwabuchi, Niwa-gun, JP;

Daiki Goto, Nagoya, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01M 15/08 (2006.01); G01L 23/18 (2006.01); G01L 23/08 (2006.01); G01L 19/06 (2006.01); G01L 23/10 (2006.01); F02B 77/08 (2006.01); F02F 1/24 (2006.01);
U.S. Cl.
CPC ...
G01L 23/18 (2013.01); F02B 77/085 (2013.01); G01L 19/0681 (2013.01); G01L 23/08 (2013.01); G01L 23/10 (2013.01); F02F 1/24 (2013.01);
Abstract

A pressure sensor includes: a diaphragm joined to a front side of a housing via a joint portion; a sensor portion; a connection portion connecting the diaphragm to the sensor portion; and a heat receiving portion disposed at the front side of the diaphragm. When: a minimum value of an area of a minimum inclusion region which is a virtual region, which include a cross-section of a portion from the heat receiving portion to the diaphragm and of which an overall length of a contour become minimum on a cross-section perpendicular to the axial line, is defined as a connection area Sn; and an area of a region surrounded by the joint portion on a projection plane perpendicular to the axial line when the diaphragm and the heat receiving portion are projected onto the projection plane is defined as a diaphragm effective area Sd, (Sn/Sd)≤0.25 is satisfied.


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