The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Apr. 20, 2018
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Lorenzo Baldo, Bareggio, IT;

Sarah Zerbini, Fontanellato, IT;

Enri Duqi, Milan, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0052 (2013.01); B81B 3/0021 (2013.01); B81B 7/0006 (2013.01); B81C 1/00158 (2013.01); B81C 1/00182 (2013.01); G01L 9/0072 (2013.01); B81B 2201/0264 (2013.01); B81C 2201/0116 (2013.01);
Abstract

A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate made of polysilicon, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.


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