The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Nov. 20, 2018
Applicant:

Elite Electronic Material (Zhongshan) Co., Ltd., Zhongshan, Guang Dong Province, CN;

Inventors:

Zhilong Hu, Zhongshan, CN;

Hezong Zhang, Zhongshan, CN;

Assignee:

ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD., Zhongshan, Guang Dong Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08L 9/02 (2006.01); C08L 25/14 (2006.01); C08K 5/5399 (2006.01); C08K 3/013 (2018.01); C08K 5/00 (2006.01); C08L 33/08 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08K 3/013 (2018.01); C08K 5/0025 (2013.01); C08K 5/5399 (2013.01); C08L 9/02 (2013.01); C08L 25/14 (2013.01); C08L 33/08 (2013.01); C08L 2203/20 (2013.01);
Abstract

A resin composition comprises 100 parts by weight of epoxy resin; 2 to 50 parts by weight of carboxyl-containing butadiene acrylonitrile resin; 1 to 40 parts by weight of phosphazene; and 1 to 8 parts by weight of acrylic triblock copolymer. The resin composition may be made into various articles, such as prepregs, laminates, printed circuit boards or rigid-flex boards, and meets one, more or all of the following properties: high yield rate in solder pad fall-off test at high temperature, low dust weight loss, low stickiness, high thermal resistance, high peel strength to copper foil, and high bonding strength to polyimide layer.


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