The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Oct. 20, 2017
Applicant:
Ems-patent Ag, Domat/Ems, CH;
Inventors:
Takamasa Fujii, Tokyo, JP;
Naoyuki Sasaki, Tokyo, JP;
Assignee:
EMS-Patent AG, Domat/Ems, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/01 (2006.01); B29C 45/00 (2006.01); C08K 5/24 (2006.01); C08L 77/02 (2006.01); C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
C08K 5/01 (2013.01); B29C 45/0001 (2013.01); C08K 5/24 (2013.01); C08L 77/02 (2013.01); C08L 77/06 (2013.01);
Abstract
The present invention refers to a polyamide moulding composition having an excellent adhesion to metal surfaces. Moreover, the present invention refers to structural parts with a metal component directly bonded to a thermoplastic component (interconnected without using a bonding agent/layer). The present invention also relates to a method for manufacturing of such structural parts by an injection moulding or extrusion processes.
Fujii, Takamasa. (2020). Polyamide moulding composition and multi-layered structure made therefrom (U.S. Patent No. 10577478). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10577478
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile