The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

May. 13, 2016
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Ryan E. Marx, Rosemount, MN (US);

David A. Ylitalo, Stillwater, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/25 (2018.01); C08G 18/08 (2006.01); C08G 18/42 (2006.01); C09J 133/08 (2006.01); B64C 21/10 (2006.01); C08G 18/66 (2006.01); C08G 18/32 (2006.01); B64D 45/00 (2006.01);
U.S. Cl.
CPC ...
C08G 18/0895 (2013.01); B64C 21/10 (2013.01); C08G 18/3203 (2013.01); C08G 18/4277 (2013.01); C08G 18/664 (2013.01); C09J 7/25 (2018.01); C09J 133/08 (2013.01); B64C 2230/26 (2013.01); B64D 2045/009 (2013.01); C08G 2270/00 (2013.01); C09J 2475/006 (2013.01);
Abstract

Thermally stable microstructured layers comprising polyurethane, polyurea and/or polyurethane/urea semi-IPN materials are provided which have microstructured surfaces which are highly durable, erosion resistant, and thermally stable. The microstructured layer comprises a semi-IPN of a polymer network selected from the group consisting of urethane acrylate polymer networks, urethane/urea acrylate polymer networks and urea acrylate polymer networks and a linear or branched polymer that is a thermoplastic polymer selected from the group consisting of thermoplastic polyurethanes, thermoplastic polyurethane/polyureas, thermoplastic polyureas, and combinations thereof. The microstructures are thermally stable at temperatures above the crossover point of the thermoplastic polymer, despite comprising a majority of such thermoplastic material. In another aspect, the present disclosure provides methods of making microstructured layers according to the present disclosure.


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