The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Jun. 25, 2019
Mimaki Engineering Co., Ltd., Nagano, JP;
Nobutaka Matsunaga, Nagano, JP;
MIMAKI ENGINEERING CO., LTD., Nagano, JP;
Abstract
Provided is a method for favorable bonding between an adherend and an adhesive body, which is capable of suppressing an ink layer, which is formed by an ultraviolet-curable ink, from being smudged while increasing convenience of a bonding operation between the adherend and the adhesive body, and the like. The method for bonding a medium to a foil body includes an ink layer formation process of spotting an ultraviolet-curable ink, which is ejected from an inkjet head, to a medium and irradiating ultraviolet ray to the ultraviolet-curable ink to cure the same, thereby forming an ink layer; a lamination process of laminating the medium and a foil body with the ink layer being sandwiched therebetween; and a bonding process of heating the ink layer, enabling the ink layer to function as an adhesive, and bonding the medium to the foil body.