The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Aug. 04, 2017
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Toshiro Adachi, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 17/00 (2006.01); H01F 27/28 (2006.01); H05K 1/18 (2006.01); H05K 1/16 (2006.01); H01F 17/06 (2006.01); H01F 27/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01); H01F 17/0033 (2013.01); H01F 17/062 (2013.01); H01F 27/2804 (2013.01); H01F 27/2895 (2013.01); H05K 1/165 (2013.01); H05K 1/185 (2013.01); H01F 2017/0086 (2013.01); H01F 2027/065 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A module includes a wiring board, an insulating layer that is laminated on the bottom surface of the wiring board, a ring-shaped coil core that is embedded in the insulating layer, a coil electrode that is wound around the coil core, electronic components that are disposed in an inner region surrounded by the coil core in the insulating layer, and an electronic component that is mounted on or in the top surface of the wiring board. With this configuration, the areas of main surfaces of the wiring board and main surfaces of the insulating layer are not large, whereas if the electronic components were mounted on or in the top surface of the wiring board, the areas of the main surfaces of the wiring board and the main surfaces of the insulating layer would be large, and a reduction in the size of the module can be facilitated.


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