The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Nov. 13, 2018
International Business Machines Corporation, Armonk, NY (US);
Jennifer I. Bennett, Rochester, MN (US);
Eric J. Campbell, Rochester, MN (US);
Sarah K. Czaplewski-Campbell, Rochester, MN (US);
Elin F. Labreck, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A process of utilizing heat-shielding microcapsules to protect a temperature sensitive component includes applying a shielding layer including heat-shielding microcapsules to a temperature sensitive component disposed on a surface of a printed circuit board. The process also includes performing a processing operation on the printed circuit board according to a set of process parameters. The set of process parameters specify a particular period of time (t) that a processing temperature (T) is to be maintained in excess of a liquidous temperature (T) for solder reflow. During the processing operation, the heat-shielding microcapsules absorb heat to reduce a time above liquidous (TAL) of the temperature sensitive component.