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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10575382 B1

PDFFull Text
Date of Patent:
Feb. 25, 2020

Filed:

Mar. 11, 2019

Optical module

Applicants:

Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;

Hisense Broadband Multimedia Technologies, Ltd., Tortola, VG;

Inventor:

Long Zheng, Shandong, CN;

Assignees:

Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;

Hisense Broadband Multimedia Technologies, Ltd., Tortola, VG;

Attorney:

Brinks Gilson & Lione

Primary Examiner:

David C Payne

Assistant Examiner:

Pranesh K Barua

Int. Cl.
CPC ...
H04K 3/00 (2006.01); H05B 37/02 (2006.01); H05K 1/00 (2006.01); F21V 29/504 (2015.01); F21V 29/508 (2015.01); F21V 29/83 (2015.01); F21V 5/04 (2006.01); F21V 23/00 (2015.01); G02B 6/42 (2006.01); H05K 9/00 (2006.01); H04B 10/40 (2013.01); H04B 10/50 (2013.01); H04B 10/85 (2013.01); H04B 15/02 (2006.01);
U.S. Cl.
CPC ...
H05B 37/0209 (2013.01); F21V 5/04 (2013.01); F21V 23/005 (2013.01); F21V 29/504 (2015.01); F21V 29/508 (2015.01); F21V 29/83 (2015.01); G02B 6/4206 (2013.01); G02B 6/428 (2013.01); G02B 6/4214 (2013.01); G02B 6/4246 (2013.01); G02B 6/4251 (2013.01); G02B 6/4256 (2013.01); G02B 6/4274 (2013.01); G02B 6/4283 (2013.01); G02B 6/4292 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); H04B 10/85 (2013.01); H04B 15/02 (2013.01); H05K 1/00 (2013.01); H05K 9/0058 (2013.01);
Abstract

The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

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