The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Dec. 27, 2018
Applicants:

The Trustees of the Stevens Institute of Technology, Hoboken, NJ (US);

Ccc Technology Holdings, Llc, New York, NY (US);

Inventors:

Solomon Harsha, Los Gatos, CA (US);

Khaldoun Khashanah, Oak Ridge, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 29/08 (2006.01); H04L 12/933 (2013.01); G06F 15/173 (2006.01); G06F 15/80 (2006.01);
U.S. Cl.
CPC ...
H04L 49/109 (2013.01); G06F 15/17381 (2013.01); G06F 15/8023 (2013.01);
Abstract

The present disclosure relates to Compute-Communicate Continuum ('CCC') technology, which challenges today's use model of Computing and Communications as independent but interfacing entities. CCC technology conflates computing and communications to create a new breed of device. Compute-Communicate Continuum metal algorithms allow a software programmer to compile/link/load and run his software application directly on device hardware providing Super Computing and Extreme Low Latency links for demanding financial applications and other applications. CCC based multiple CCC-DEVICE hardware platforms can be interconnected using its ELL 'Metal Shared Memory Interconnects' form what looks like a “single” machine that crosses different geographies, asset classes, and trading venues. Thus, the technology enables the creation of a new category of Compute-Communicate devices (CCC-DEVICE Series appliances) that can connect multiple geographically distributed locations with extreme low latency and provide supercomputing for distributed data using High Performance Embedded Computing (HPEC) and Extreme Low Latency (ELL) Communications.


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