The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Jun. 18, 2018
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventors:
Rei Goto, Osaka, JP;
Toru Yamaji, Nagaokakyou, JP;
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/10 (2006.01); H04B 1/38 (2015.01); H04B 11/00 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H03H 9/72 (2006.01); H03F 3/19 (2006.01); H03F 3/24 (2006.01); H03H 9/05 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H04B 15/00 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02834 (2013.01); H03F 3/19 (2013.01); H03F 3/195 (2013.01); H03F 3/21 (2013.01); H03F 3/245 (2013.01); H03H 9/02559 (2013.01); H03H 9/02897 (2013.01); H03H 9/0576 (2013.01); H03H 9/1064 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/6483 (2013.01); H03H 9/6489 (2013.01); H03H 9/725 (2013.01); H04B 1/38 (2013.01); H04B 11/00 (2013.01); H04B 15/00 (2013.01); H03F 2200/451 (2013.01);
Abstract
Aspects of this disclosure relate to a surface acoustic wave assembly that includes a first surface acoustic wave filter, a second surface acoustic wave filter, and a thermally conductive sheet configured to dissipate heat from the first surface acoustic wave filter in an area corresponding to the second surface acoustic wave filter. The thermally conductive sheet can be thinner than a piezoelectric layer of the first surface acoustic wave filter. Related radio frequency modules and methods are disclosed.