The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Feb. 05, 2019
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Takehiro Nishimura, Kusatsu, JP;
Chiaki Doumoto, Goleta, CA (US);
Kyocera Corporation, Kyoto, JP;
Abstract
A semiconductor module of the present disclosure includes: a base body including a groove part of which two inner side surfaces are inclined, the base body including an electrode pad which is provided on at least one inner side surface; and a semiconductor element including a semiconductor substrate including a first surface, a second surface opposite to the first surface, and two side surfaces which are inclined in a diagonal direction to the first surface and are opposite to each other, a semiconductor layer located on the first surface, and an electrode disposed on at least one side surface. The semiconductor element is located in the groove part so that the at least one side surface is disposed along the at least one inner side surface of the base body, and at least one electrode of the semiconductor element is connected to the electrode pad of the base body.