The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Mar. 06, 2018
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Bradley A. Newcomb, Troy, MI (US);

Xiaosong Huang, Novi, MI (US);

Ryan Gergely, Fraser, MI (US);

Sean R. Wagner, Shelby Township, MI (US);

Chaitanya Sankavaram, Sterling Heights, MI (US);

Nicholas P. Irish, Commerce, MI (US);

Louis G. Hector, Jr., Shelby Township, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/04 (2006.01); H05K 3/32 (2006.01); C09J 9/02 (2006.01); B32B 7/12 (2006.01); G01N 27/04 (2006.01); C09J 5/00 (2006.01); C09J 11/04 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
H01R 4/04 (2013.01); B32B 7/12 (2013.01); C09J 5/00 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); G01N 27/041 (2013.01); H05K 3/321 (2013.01); B32B 2250/02 (2013.01); B32B 2307/202 (2013.01); C08K 3/04 (2013.01); C08K 2201/001 (2013.01);
Abstract

A functionalized adhesive and systems and methods employing the same are disclosed. The functionalized adhesive is configured to form an adhesive joint between a first substrate and a second substrate. The functionalized adhesive comprises a neat adhesive selected to have a bonding strength above a predetermined bonding threshold and a filler selectively dispersed within the neat adhesive. The filler is selected to modify electrical properties of the neat adhesive such that the functionalized adhesive is electrically conductive with a tailored resistivity and such that a resistance of the adhesive joint is greater than a resistance of the first substrate and the second substrate.


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