The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Nov. 23, 2015
Applicant:
Nokia Technologies Oy, Espoo, FI;
Inventors:
Mark Allen, Great Cambourne, GB;
Yinglin Liu, Cambridge, GB;
Markku Rouvala, Helsinki, FI;
Surama Malik, Cambridge, GB;
Assignee:
Nokia Technologies Oy, Espoo, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/05 (2006.01); H01L 51/00 (2006.01); H01L 27/28 (2006.01); H01L 27/12 (2006.01); H01L 51/50 (2006.01); H01L 29/49 (2006.01); C09J 9/02 (2006.01); C09J 131/04 (2006.01); C09J 171/02 (2006.01); H01G 11/08 (2013.01); H01G 11/86 (2013.01); H01L 23/00 (2006.01); H01M 10/04 (2006.01); H01M 10/42 (2006.01); H01G 11/56 (2013.01);
U.S. Cl.
CPC ...
H01L 51/0537 (2013.01); C09J 9/02 (2013.01); C09J 131/04 (2013.01); C09J 171/02 (2013.01); H01G 11/08 (2013.01); H01G 11/86 (2013.01); H01L 24/29 (2013.01); H01L 27/1259 (2013.01); H01L 27/283 (2013.01); H01L 29/4908 (2013.01); H01L 51/004 (2013.01); H01L 51/0024 (2013.01); H01L 51/0034 (2013.01); H01L 51/508 (2013.01); H01M 10/04 (2013.01); H01M 10/425 (2013.01); H01G 11/56 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/063 (2013.01); H01L 2924/0705 (2013.01); H01L 2924/07812 (2013.01);
Abstract
An apparatus comprising: a module; a substrate; and electrolyte between the module and the substrate, wherein an electronic component is formed between the module and the substrate and wherein the electrolyte is configured to function as the electrolyte in the electronic component and also as the adhesive to attach the module to the substrate.