The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Aug. 21, 2018
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Jefferson W. Hall, Chandler, AZ (US);
Michael J. Seddon, Gilbert, AZ (US);
Yenting Wen, Chandler, AZ (US);
Assignee:
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/04 (2006.01); H01L 43/06 (2006.01); H01L 43/14 (2006.01); G01R 19/00 (2006.01); G01R 15/18 (2006.01); G01R 15/20 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 43/04 (2013.01); G01R 15/181 (2013.01); G01R 15/202 (2013.01); G01R 19/0092 (2013.01); G01R 31/2853 (2013.01); H01L 43/065 (2013.01); H01L 43/14 (2013.01);
Abstract
A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying conductor there through. At least one current sensor is formed in, or on, the semiconductor die and configured to sense current flow in the current-carrying conductor received in the through hole.