The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Jul. 13, 2017
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Tyler Daigle, Scarborough, ME (US);

Andrew Jordan, Scarborough, ME (US);

Hrvoje Jasa, Scarborough, ME (US);

Gregory Maher, Cape Elizabeth, ME (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 49/02 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); G01R 15/14 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 28/24 (2013.01); G01R 15/146 (2013.01); H01L 23/5228 (2013.01); H01L 23/5283 (2013.01); H01L 23/5226 (2013.01); H01L 23/53214 (2013.01); H01L 23/53257 (2013.01);
Abstract

In one general aspect, an apparatus can include a first terminal, a second terminal, and a resistive element extending between the first terminal and the second terminal. The resistive element can include a first via in contact with a first segment of a first metal layer and a first segment of a second metal layer, and can include a second via in contact with the first segment of the second metal layer and a second segment of the first metal layer. The apparatus can also include a third via in contact with the second segment of the first metal layer and a third segment of the second metal layer.


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