The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

May. 05, 2017
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Ordos Yuansheng Optoelectronics Co., Ltd., Ordos, Inner Mongolia, CN;

Inventors:

Chen Ting Liu, Beijing, CN;

Xiaodong Pan, Beijing, CN;

Zhiming Hu, Beijing, CN;

Chunxiang Nan, Beijing, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 27/02 (2006.01); H01L 27/12 (2006.01); G02F 1/1362 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); G02F 1/1368 (2006.01); G02F 1/1333 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0292 (2013.01); G02F 1/136204 (2013.01); H01L 27/0288 (2013.01); H01L 27/0296 (2013.01); H01L 27/124 (2013.01); H01L 27/1222 (2013.01); H01L 27/1244 (2013.01); H01L 27/1262 (2013.01); H01L 29/0649 (2013.01); H01L 29/66765 (2013.01); H01L 29/78633 (2013.01); H01L 29/78678 (2013.01); G02F 1/1368 (2013.01); G02F 1/136209 (2013.01); G02F 1/136286 (2013.01); G02F 2001/133388 (2013.01); G02F 2001/136295 (2013.01); G02F 2202/104 (2013.01); H01L 27/3248 (2013.01); H01L 27/3262 (2013.01); H01L 27/3272 (2013.01); H01L 27/3276 (2013.01); H01L 2227/323 (2013.01);
Abstract

An electro-static discharge assembly, an array substrate and a fabrication method thereof, and a display panel are provided. The electro-static discharge assembly includes: a base substrate; a semiconductor layer, a first insulating layer, a first auxiliary electrode, a first electrode and a second electrode provided on the base substrate, wherein the first electrode and the second electrode are spaced apart from each other and are respectively in contact with the semiconductor layer, the first auxiliary electrode is in contact with one of the first electrode and the second electrode, and the first insulating layer is provided between the first auxiliary electrode and both the first electrode and the second electrode.


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