The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Dec. 12, 2017
Applicants:

University of Florida Research Foundation, Incorporated, Gainesville, FL (US);

The University of Connecticut, Farmington, CT (US);

Inventors:

Mark M. Tehranipoor, Gainesville, FL (US);

Domenic J. Forte, Gainesville, FL (US);

Navid Asadizanjani, Gainesville, FL (US);

Qihang Shi, Farmington, CT (US);

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 21/70 (2013.01); H01L 23/00 (2006.01); G06F 21/60 (2013.01); G06F 21/87 (2013.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 23/57 (2013.01); G06F 21/60 (2013.01); G06F 21/70 (2013.01); G06F 21/87 (2013.01); H01L 23/00 (2013.01); H01L 23/576 (2013.01); G01R 31/2851 (2013.01);
Abstract

A method of assessing vulnerability of Integrated Circuit (IC) can include: preparing a list of logic nets of the IC; obtaining rectangular segments from the logic nets; finding a milling exclusion area based on a covering wire; and superimposing the found milling exclusion area onto the rectangular segments of the logic nets. The milling exclusion area is an area that microprobing attack does not succeed without cutting off at least one of the rectangular segments.


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