The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Jan. 18, 2019
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Akihiro Kimura, Kyoto, JP;
Takeshi Sunaga, Kyoto, JP;
Shouji Yasunaga, Kyoto, JP;
Akihiro Koga, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/4882 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/4334 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49555 (2013.01); H01L 23/49575 (2013.01); H01L 23/49586 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/451 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49173 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/85 (2013.01); H01L 2224/85399 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18301 (2013.01);
Abstract
A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.