The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Mar. 27, 2017
Mitsui Chemicals Tohcello, Inc., Chiyoda-ku, Tokyo, JP;
Eiji Hayashishita, Nagoya, JP;
MITSUI CHEMICALS TOHCELLO, INC., Chiyoda-Ku, Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device according to the present invention includes at least the following four steps: (A) a step of preparing a structure () including an adhesive laminate film () having a heat-resistant resin layer (), a flexible resin layer () and an adhesive resin layer () in this order, and one or two or more semiconductor chips () adhered to the adhesive resin layer (); (B) a step of confirming an operation of the semiconductor chips () in a state of being adhered to the adhesive resin layer (); (C) a step of, after the step (B), peeling the heat-resistant resin layer () from the adhesive laminate film (); and (D) a step of, after the step (C), picking up the semiconductor chips () from the adhesive resin layer ().