The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Jan. 03, 2018
Applicant:
Te Connectivity Sensors Germany Gmbh, Dortmund, DE;
Inventor:
Georg Stute, Velbert, DE;
Assignee:
TE Connectivity Sensors Germany GmbH, Dortmund, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/00 (2006.01); G01D 11/24 (2006.01); H01L 25/10 (2006.01); H01L 25/16 (2006.01); G01R 33/022 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); G01R 33/09 (2006.01);
U.S. Cl.
CPC ...
G01R 33/0047 (2013.01); G01D 11/245 (2013.01); G01R 33/022 (2013.01); H01L 23/3107 (2013.01); H01L 23/49548 (2013.01); H01L 25/10 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); G01R 33/096 (2013.01); H01L 23/49541 (2013.01); H01L 2225/1064 (2013.01);
Abstract
An electrical structural member comprises a first package and a second package. The first package has a first connection frame, a chip disposed in the first connection frame, and a first encapsulation material encapsulating the chip and at least portions of the first connection frame. The second package has a second connection frame and a second encapsulation material encapsulating at least portions of the second connection frame. The first encapsulation material is securely connected to the second encapsulation material.