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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10570805 B1

PDFFull Text
Date of Patent:
Feb. 25, 2020

Filed:

Nov. 29, 2017

Cooling system for vehicle

Applicant:

Honda Motor Co., Ltd., Tokyo, JP;

Inventors:

Hajime Uto, Wako, JP;

Noritaka Kimura, Wako, JP;

Yuto Katori, Wako, JP;

Assignee:

HONDA MOTOR CO., LTD., Tokyo, JP;

Attorney:

Mori & Ward, LLP

Primary Examiner:

Grant Moubry

Int. Cl.
CPC ...
F01P 7/14 (2006.01); B60H 1/00 (2006.01); F02B 29/04 (2006.01); H01M 10/625 (2014.01); B60K 11/02 (2006.01); F01P 3/12 (2006.01); B60K 11/04 (2006.01); F01P 7/16 (2006.01); H01M 10/663 (2014.01); H01M 10/613 (2014.01); F01P 5/10 (2006.01); B60K 1/00 (2006.01); B60L 50/15 (2019.01); B60L 50/16 (2019.01); F01P 3/18 (2006.01);
U.S. Cl.
CPC ...
F01P 7/14 (2013.01); B60H 1/00278 (2013.01); B60K 11/02 (2013.01); B60K 11/04 (2013.01); F01P 3/12 (2013.01); F01P 7/165 (2013.01); F02B 29/0412 (2013.01); F02B 29/0443 (2013.01); F02B 29/0493 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/663 (2015.04); B60K 2001/003 (2013.01); B60K 2001/005 (2013.01); B60L 50/15 (2019.02); B60L 50/16 (2019.02); B60L 2240/445 (2013.01); F01P 7/164 (2013.01); F01P 2003/185 (2013.01); F01P 2005/105 (2013.01); F01P 2007/146 (2013.01); F01P 2025/08 (2013.01); F01P 2025/32 (2013.01); F01P 2025/36 (2013.01); F01P 2025/50 (2013.01); F01P 2050/24 (2013.01); F01P 2060/02 (2013.01); Y02T 10/146 (2013.01);
Abstract

A cooling system for a vehicle, includes a first cooling circuit including a first coolant passage and a first pump. The first pump is provided in the first coolant passage to circulate coolant in the first cooling circuit so as to cool a first device to a first temperature. A second cooling circuit includes a second coolant passage and a second pump. The second pump is provided in the second coolant passage to circulate coolant in the second cooling circuit so as to cool a second device to a second temperature. The second temperature is lower than the first temperature. The coolant introduction passage connects the first cooling circuit and a connected portion of the second cooling circuit between the second device and a second radiator and upstream of the second device to supply the coolant in the first cooling circuit to the second cooling circuit.

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