The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Nov. 16, 2015
Applicant:

Environmentally Safe Products, Inc., New Oxford, PA (US);

Inventors:

Cory L. Groft, Littlestown, PA (US);

Thomas W. Dauber, Spring Grove, PA (US);

Thomas E. Wright, Biglerville, PA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E04B 1/80 (2006.01); E04D 12/00 (2006.01); B32B 5/02 (2006.01); B32B 5/20 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); B32B 27/12 (2006.01); B32B 27/32 (2006.01);
U.S. Cl.
CPC ...
E04B 1/80 (2013.01); B32B 5/028 (2013.01); B32B 5/20 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); E04D 12/002 (2013.01); B32B 2305/022 (2013.01); B32B 2307/304 (2013.01);
Abstract

An underlayment that meets underlayment requirements and provides thermal insulation is disclosed. The underlayment includes a core material and an upper emittance layer having an exterior surface. An upper reinforcement layer is positioned between the upper emittance layer and the core material. A first encapsulation layer is positioned between the upper emittance layer and the upper reinforcement layer. A second encapsulation layer is positioned between the upper reinforcement layer and the core material. The underlayment includes a lower emittance layer having an exterior surface. A lower reinforcement layer is positioned between the lower emittance layer and the core material. A third encapsulation layer is positioned between the lower emittance layer and the lower reinforcement layer. A fourth encapsulation layer is positioned between the lower reinforcement layer and the core material.


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