The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Jun. 19, 2014
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Hideyoshi Kinoshita, Satsumasendai, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 29/04 (2006.01); B23B 27/14 (2006.01); C04B 35/58 (2006.01); C04B 35/64 (2006.01); C22C 29/00 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
C22C 29/04 (2013.01); B23B 27/148 (2013.01); C04B 35/58021 (2013.01); C04B 35/64 (2013.01); C22C 29/005 (2013.01); B22F 2005/001 (2013.01); B23B 2222/16 (2013.01); C04B 2235/3839 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/3856 (2013.01); C04B 2235/3886 (2013.01); C04B 2235/405 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6567 (2013.01);
Abstract

A cermet () includes a bonding phase () and a hard phase (). The hard phase () includes: a first hard phase () composed of TiCN; and a second hard phase () composed of a composite carbonitride of Ti, which is greater than the average particle diameter of the first hard phase (). The cermet () further includes an aggregate part () formed by interlinking parts of the second hard phase (). The second hard phase () forming the aggregate part () includes a 2a-th hard phase () having a maximum W content of an inner part thereof that is more than 1.1 times as great as an average W content of an outer circumferential part thereof, in terms of mass ratio. The aggregate part () composes a proportion of from 20% to 60% of the cermet () in terms of surface area.


Find Patent Forward Citations

Kinoshita, Hideyoshi. (2020). Cermet, and method for manufacturing same, as well as cutting tool (U.S. Patent No. 10570486). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10570486

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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