The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Jul. 12, 2018
Applicant:

Mitsubishi Shindoh Co, Ltd., Tokyo, JP;

Inventor:

Keiichiro Oishi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/04 (2006.01); B22D 21/02 (2006.01); C22C 1/06 (2006.01); C22C 30/02 (2006.01); C22C 30/06 (2006.01); C22F 1/08 (2006.01); B22D 27/00 (2006.01); C22C 1/03 (2006.01); C22C 9/00 (2006.01);
U.S. Cl.
CPC ...
C22C 9/04 (2013.01); B22D 21/022 (2013.01); B22D 21/025 (2013.01); B22D 27/00 (2013.01); C22C 1/03 (2013.01); C22C 1/06 (2013.01); C22C 9/00 (2013.01); C22C 30/02 (2013.01); C22C 30/06 (2013.01); C22F 1/08 (2013.01);
Abstract

A copper-based alloy casting includes 69 to 88% of Cu, 2 to 5% of Si, 0.0005 to 0.04% of Zr, 0.01 to 0.25% of P by mass, and a remainder including Zn and inevitable impurities, and satisfies 60≤Cu−3.5×Si−3×P≤71. Further, mean grain size after melt-solidification is 100 μm or less, and α, κ and γ-phases occupy more than 80% of phase structure. Furthermore, the copper-based alloy casting according to the invention can further include at least one element selected from a group consisting of 0.001 to 0.2% of Mg, 0.003 to 0.1% of B, 0.0002 to 0.01% of C, 0.001 to 0.2% of Ti and 0.01 to 0.3% of rare earth element.


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