The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Dec. 21, 2015
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Ryosuke Izumi, Kariya, JP;

Noritaka Inoue, Kariya, JP;

Hodaka Mori, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); C08J 5/12 (2006.01); B29K 67/00 (2006.01); B29K 81/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14 (2013.01); C08J 5/124 (2013.01); B29K 2067/006 (2013.01); B29K 2081/04 (2013.01); C08J 2381/02 (2013.01); C08J 2463/00 (2013.01);
Abstract

A resin molded article includes an insert component and a synthetic resin member sealing the insert component. The insert component is provided by a primary molded product of a thermosetting resin, or a metal component, and has a functional group. The synthetic resin member is provided by a synthetic resin including a base polymer of a thermoplastic resin and a bonding component bonding with the functional group included in the insert component. The synthetic resin member has a sea structure formed of a continuous phase including the base polymer, and at least a part of the bonding component is present as a dispersed component in the sea structure. The dispersed component bonds with the functional group included in the insert component.


Find Patent Forward Citations

Loading…