The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Sep. 08, 2017
Applicant:

Aptiv Technologies Limited, St. Michael, BB;

Inventors:

Katarzyna Bolek, Skawina, PL;

Grzegorz Paletko, Zabierzow, PL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/12 (2006.01); B23K 20/10 (2006.01); G01G 19/414 (2006.01);
U.S. Cl.
CPC ...
B23K 31/125 (2013.01); B23K 20/10 (2013.01); G01G 19/414 (2013.01);
Abstract

A method used to predict a strength of an ultrasonic weld-joint of a wire-cable comprising the steps of providing a wire-cable, determining a combined-weight, removing a contaminant, removing a solvent, determining a weight, determining a percentage by weight of the contaminant, and determining whether the percentage by weight of contaminant is less than a threshold. Determining the percentage by weight of the contaminant removed from the wire-cable is based on a formula [(Mb−Ma)/Mb]*100, where Mb is the combined-weight of the wire-cable and the contaminant and Ma is the weight of the wire-cable. The threshold of the percentage by weight of the contaminant correlates to the strength of the ultrasonic weld-joint.


Find Patent Forward Citations

Bolek, Katarzyna. (2020). Method to predict a strength of an ultrasonic weld-joint (U.S. Patent No. 10569367). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10569367

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…