The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Aug. 01, 2016
Applicant:
Fuji Corporation, Chiryu-shi, JP;
Inventors:
Satoru Otsubo, Anjo, JP;
Noriaki Iwaki, Hekinan, JP;
Assignee:
FUJI CORPORATION, Chiryu-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/08 (2006.01); H05K 3/34 (2006.01); B23K 3/06 (2006.01); B23K 20/00 (2006.01); B23K 101/42 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 1/08 (2013.01); B23K 1/0016 (2013.01); B23K 1/085 (2013.01); B23K 3/0653 (2013.01); B23K 20/00 (2013.01); H05K 3/34 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08);
Abstract
A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.