The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Dec. 01, 2015
Applicant:

Samsung Medison Co., Ltd., Hongcheon-gun, Gangwon-do, KR;

Inventors:

Jin Ho Gu, Hwaseong-si, KR;

Jae-Yk Kim, Seongnam-si, KR;

Jong Mok Lee, Yongin-si, KR;

Young Mun Cho, Seoul, KR;

Assignee:

Samsung Medison Co., Ltd., Hongcheon-gun, Gangwon-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4444 (2013.01); A61B 8/4494 (2013.01);
Abstract

An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.


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