The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Oct. 05, 2016
Applicants:

Hiroyuki Fukushima, Lansing, MI (US);

Thomas Ritch, East Lansing, MI (US);

Jessica Russell, Webberville, MI (US);

Liya Wang, Ann Arbor, MI (US);

Inventors:

Hiroyuki Fukushima, Lansing, MI (US);

Thomas Ritch, East Lansing, MI (US);

Jessica Russell, Webberville, MI (US);

Liya Wang, Ann Arbor, MI (US);

Assignee:

XG Sciences, Inc., Lansing, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/10 (2006.01); H05K 7/20 (2006.01); A61B 5/103 (2006.01); A61B 5/00 (2006.01); A61B 3/11 (2006.01); A61B 5/11 (2006.01); A61B 3/00 (2006.01); A61B 3/14 (2006.01); F28F 19/02 (2006.01); B82Y 30/00 (2011.01); F28F 3/00 (2006.01); B32B 15/08 (2006.01); F28F 13/18 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/103 (2013.01); A61B 3/0025 (2013.01); A61B 3/112 (2013.01); A61B 5/0059 (2013.01); A61B 5/1104 (2013.01); A61B 5/1107 (2013.01); A61B 5/4824 (2013.01); A61B 3/145 (2013.01); B32B 15/08 (2013.01); B82Y 30/00 (2013.01); F28F 3/00 (2013.01); F28F 13/18 (2013.01); F28F 19/02 (2013.01); F28F 2013/005 (2013.01); F28F 2245/06 (2013.01); H05K 7/20509 (2013.01);
Abstract

The development and manufacture of thermal interface materials including, among other forms, greases, pastes, gels, adhesives, pads, sheets, solders and phase change materials, with good through-plane thermal conductivity for thermal interface applications. The good through-plane thermal conductivity is achieved through the formation of a conductive network by the use of thermal conductive material-coated fillers, combinations of thermal conductive material-coated fillers and uncoated fillers.


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