The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Jun. 20, 2017
Applicant:
Ceramtec Gmbh, Plochingen, DE;
Inventors:
Assignee:
CeramTec GmbH, Plochingen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/12 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); C22F 1/08 (2006.01); H05K 1/03 (2006.01); H05K 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1216 (2013.01); C22F 1/08 (2013.01); H01L 21/4867 (2013.01); H01L 23/49844 (2013.01); H05K 1/0306 (2013.01); H05K 3/22 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/24355 (2015.01);
Abstract
A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or AlO. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.