The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Jan. 16, 2019
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Ching-Chi Kuo, Taoyuan, TW;

Yi-Hwa Hsieh, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/184 (2013.01); H05K 3/301 (2013.01); H05K 3/303 (2013.01); H05K 3/306 (2013.01); H05K 7/20 (2013.01); H05K 7/209 (2013.01); H05K 7/20445 (2013.01); H05K 1/0203 (2013.01); H05K 3/3447 (2013.01);
Abstract

A printed circuit board assembly includes a printed circuit board, an electronic device, a holder and a heat-dissipation device. The printed circuit board includes a first through hole. The electronic device includes a first surface and a second surface opposite to each other, and a pin passing through the first through hole of the printed circuit board and inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device, and an opening disposed on the supporting surface to receive the pin of electronic device passing therethrough. The holder is configured to provide an accommodation space between the supporting surface and the printed circuit board. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.


Find Patent Forward Citations

Kuo, Ching-Chi. (2020). Printed circuit board assembly and assembling method thereof (U.S. Patent No. 10568206). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10568206

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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