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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10568198 B1

PDFFull Text
Date of Patent:
Feb. 18, 2020

Filed:

Nov. 01, 2017

Printed circuit board and semiconductor package structure

Applicant:

Shanghai Zhaoxin Semiconductor Co., Ltd., Shanghai, CN;

Inventors:

Nai-Shung Chang, New Taipei, TW;

Tsai-Sheng Chen, New Taipei, TW;

Chang-Li Tan, New Taipei, TW;

Yun-Han Chen, New Taipei, TW;

Hsiu-Wen Ho, New Taipei, TW;

Assignee:

SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD., Shanghai, CN;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Dharti H Patel

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); H01L 23/495 (2006.01); H01L 23/50 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); H01L 23/145 (2013.01); H01L 23/3114 (2013.01); H01L 23/49589 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/50 (2013.01); H01L 24/16 (2013.01); H05K 1/0219 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H05K 3/0073 (2013.01); H05K 3/3452 (2013.01); H05K 3/4007 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H05K 1/114 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes via hole column units periodically arranged along a first direction. Each via hole column unit includes first to sixth via holes passing through the body and electrically connected to a capacitor. Any two adjacent via holes of the first to sixth via holes transmit power and ground signals. The sixth via hole of one of the via hole column units is adjacent to the first via hole of another one of the via hole column units, which is adjacent to the one of the via hole column units. The sixth via hole of one of the via hole column units and the first via hole of another one of the via hole column units transmit power and ground signals.

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