The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10566515 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 18, 2020

Filed:

Jun. 13, 2019
Applicant:

Sridhar Kasichainula, Fremont, CA (US);

Inventor:

Sridhar Kasichainula, Fremont, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 35/34 (2006.01); H02S 30/20 (2014.01); H02S 10/10 (2014.01); H01L 35/30 (2006.01); H01L 35/08 (2006.01); H01L 35/32 (2006.01); H02S 40/44 (2014.01); H01L 31/054 (2014.01);
U.S. Cl.
CPC ...
H01L 35/34 (2013.01); H01L 31/0547 (2014.12); H01L 35/08 (2013.01); H01L 35/30 (2013.01); H01L 35/32 (2013.01); H02S 10/10 (2014.12); H02S 30/20 (2014.12); H02S 40/44 (2014.12); Y02E 10/52 (2013.01);
Abstract

A thin-film based thermoelectric module includes a flexible substrate, a number of electrically conductive pads disposed on the flexible substrate, and a number of pairs of N-type and P-type thermoelectric legs electrically in contact with one another formed on corresponding electrically conductive pads of the number of electrically conductive pads such that an area of each N-type thermoelectric leg and another area of each P-type thermoelectric leg are each more than an area of the corresponding electrically conductive pad to allow for extension thereof outside the corresponding electrically conductive pad. The flexible substrate is aluminum (Al) foil, a sheet of paper, teflon, plastic, a single-sided copper (Cu) clad laminate sheet, or a double-sided Cu clad laminate sheet, and has a dimensional thickness less than or equal to 25 μm. The thin-film based thermoelectric module is less than or equal to 100 μm in dimensional thickness.


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