The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Mar. 14, 2016
Applicant:
Hitachi, Ltd., Tokyo, JP;
Inventors:
Hiroki Kaneko, Tokyo, JP;
Takashi Naito, Tokyo, JP;
Yoshifumi Sekiguchi, Tokyo, JP;
Tatsuya Miyake, Tokyo, JP;
Assignee:
HITACHI, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); C03C 8/24 (2006.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H04N 5/225 (2006.01); C03C 27/06 (2006.01); G06T 7/55 (2017.01); G06T 7/70 (2017.01); B60J 1/00 (2006.01); B60J 1/02 (2006.01); B60J 1/18 (2006.01); B60Q 1/04 (2006.01); B60Q 1/22 (2006.01); F25D 27/00 (2006.01); H01L 33/62 (2010.01); H04N 5/247 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); C03C 8/24 (2013.01); C03C 27/06 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H04N 5/2256 (2013.01); B60J 1/001 (2013.01); B60J 1/02 (2013.01); B60J 1/18 (2013.01); B60Q 1/04 (2013.01); B60Q 1/22 (2013.01); F25D 27/00 (2013.01); G06T 7/55 (2017.01); G06T 7/70 (2017.01); G06T 2207/30196 (2013.01); G06T 2207/30252 (2013.01); H01L 33/62 (2013.01); H04N 5/247 (2013.01);
Abstract
The purpose of the present invention is to decrease the process temperature for a multilayer glass into which an optical element is to be packed, thereby reducing the damage to the optical element during processing. A multilayer glass according to the present invention is so configured that a gap formed between glass plates is sealed with a sealing material that can fix at a process temperature lower than a temperature employed for the processing of an optical element (see FIG.).