The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Mar. 23, 2017
Applicant:

Ams Sensors Singapore Pte. Ltd., Singapore, SG;

Inventors:

Martin Lukas Balimann, Zurich, CH;

Matthias Gloor, Boswil, CH;

Philippe Bouchilloux, Singapore, SG;

Jukka Alasirniö, Jääli, FI;

Hartmut Rudmann, Jona, CH;

Nicola Spring, Wangen, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 27/146 (2006.01); H01L 31/0232 (2014.01); H05K 1/02 (2006.01); H01L 31/024 (2014.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 51/52 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14636 (2013.01); H01L 31/024 (2013.01); H01L 31/02005 (2013.01); H01L 31/02019 (2013.01); H01L 31/02325 (2013.01); H01L 31/02327 (2013.01); H01L 33/483 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/647 (2013.01); H01L 51/529 (2013.01); H01L 51/5237 (2013.01); H01L 51/5275 (2013.01); H01S 5/02208 (2013.01); H01S 5/02236 (2013.01); H01S 5/02288 (2013.01); H01S 5/02469 (2013.01); H05K 1/021 (2013.01); H01L 27/14685 (2013.01); H01L 31/18 (2013.01); H01L 33/48 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2203/049 (2013.01);
Abstract

An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.


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