The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Sep. 10, 2018
Applicant:
Sensors Unlimited, Inc., Princeton, NJ (US);
Inventors:
Namwoong Paik, Lawrenceville, NJ (US);
Wei Huang, Plainsborough, NJ (US);
Assignee:
Sensors Unlimited, Inc., Princeton, NJ (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 27/1469 (2013.01); H01L 27/14605 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/034 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/119 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13022 (2013.01);
Abstract
A method of forming bump structures for interconnecting components includes dry etching a layer of insulating material to create a pattern for bump structures. A seed layer is deposited on the insulating material over the pattern. The seed layer is patterned with a photo resist material. The method also includes forming bump structures over the seed layer and the photo resist material with a plating material to form bump structures in the pattern, wherein the bump structures are isolated from one another.