The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Jan. 16, 2018
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Yo Tanaka, Chiyoda-ku, JP;

Shinnosuke Soda, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 23/498 (2006.01); H01L 23/053 (2006.01); H02M 7/00 (2006.01); H02M 7/5387 (2007.01); H01L 23/00 (2006.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/053 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 24/33 (2013.01); H02M 7/003 (2013.01); H02M 7/53871 (2013.01); H01L 2224/33 (2013.01); H02P 27/08 (2013.01);
Abstract

Provided are a semiconductor device which is provided with a circuit board and capable of suppressing an increase in its footprint, and a power conversion apparatus including the semiconductor device. The semiconductor device includes a circuit board, a power semiconductor element, an insulating block, a control signal terminal, a first main terminal, and a second main terminal. The insulating block is disposed so as to surround the power semiconductor element. The control signal terminal is inserted into the insulating block and thereby fixed to the insulating block. The control signal terminal includes a bent portion which partially protrudes above the power semiconductor element from the insulating block, and is bonded to the power semiconductor element. The first main terminal is bonded to the same power semiconductor element as the power semiconductor element to which the control signal terminal is bonded. The second main terminal is bonded to the circuit board.


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