The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Jul. 06, 2018
Toshiba Memory Corporation, Minato-ku, JP;
Isao Ozawa, Chigasaki, JP;
Isao Maeda, Yokohama, JP;
Yasuo Kudo, Higashiyamato, JP;
Koichi Nagai, Tokyo, JP;
Katsuya Murakami, Tokyo, JP;
Toshiba Memory Corporation, Minato-ku, JP;
Abstract
According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.