The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Sep. 05, 2018
Applicant:
Coolstar Technology, Inc., Sunnyvale, CA (US);
Inventors:
Shuming Xu, Sunnyvale, CA (US);
Yi Zheng, Sunnyvale, CA (US);
Assignee:
COOLSTAR TECHNOLOGY, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 23/31 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/4871 (2013.01); H01L 21/4882 (2013.01); H01L 23/3677 (2013.01); H01L 23/4275 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/3128 (2013.01); H01L 29/0657 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A semiconductor device having enhanced thermal transfer includes at least one die, including a device layer in which one or more functional circuit elements are formed and a substrate supporting the device layer, and a support structure. The die is disposed on the support structure using at least one connection structure coupled between the device layer and the support structure. A back surface of the substrate is textured so as to increase a surface area of the back surface to thereby enhance thermal transfer between the substrate and an external environment.