The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Feb. 22, 2018
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); G11C 29/48 (2006.01); H01L 23/485 (2006.01); G11C 5/04 (2006.01); H01L 23/31 (2006.01); G11C 29/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G11C 5/04 (2013.01); G11C 29/1201 (2013.01); G11C 29/48 (2013.01); H01L 23/3114 (2013.01); H01L 23/485 (2013.01);
Abstract
A semiconductor device includes a plurality of stacked chips is disclosed. Each of the stacked chips includes a plurality of through vias arranged in a regular polygonal shape. The through vias of each chip are formed at corresponding positions in a stacked direction. The respective through vias of each chip are electrically connected to through vias of a chip adjacent in the stacked direction in a manner that the connected through vias are spaced apart from one another in substantially the same direction.