The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Feb. 03, 2017
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Erlanger, KY (US);

Inventors:

Yuji Fukuoka, Northville, MI (US);

Ercan Dede, Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/467 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4735 (2013.01); H01L 23/3672 (2013.01); H01L 23/467 (2013.01);
Abstract

An electronics assembly includes a cooling chip structure having a target layer and a jet impingement layer coupled to the target layer. The jet impingement layer has one or more jet channels disposed within the jet impingement layer. Further, one or more through substrate vias are disposed within the jet impingement layer, where the one or more through substrate vias are electrically conductive and are electrically coupled to the target layer. A fluid inlet port and a fluid outlet port are fluidly coupled to the one or more jet channels of the jet impingement layer.


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