The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Feb. 22, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Jian Jun Kong, Sichuan, CN;

She Yu Tang, Sichuan, CN;

Tian Yi Zhang, Sichuan, CN;

Qin Xu Yu, Chengdu, CN;

Sheng Pin Yang, Chengdu, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 21/311 (2006.01); H01L 21/683 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); H01L 21/31111 (2013.01); H01L 21/32134 (2013.01); H01L 21/6836 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01);
Abstract

In some embodiments, a method of forming an integrated circuit includes providing a semiconductor substrate having an electronic circuit formed on a front side, and having a first material layer located over a second side of the substrate and a second material layer located between the first material layer and the second side. At least a portion of the first material layer is removed using a first chemical etching process, thereby exposing the second material layer. At least a portion of the second material layer is removed using a second chemical etching process. A portion of the substrate is then mechanically removed from the second side.


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