The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

May. 31, 2017
Applicant:

Laser Systems & Solutions of Europe, Gennevilliers, FR;

Inventor:

Fulvio Mazzamuto, Paris, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02381 (2013.01); H01L 21/0257 (2013.01); H01L 21/02532 (2013.01); H01L 21/02675 (2013.01); H01L 21/268 (2013.01); H01L 21/2652 (2013.01);
Abstract

Disclosed is a process for manufacturing a deep junction electronic device including steps of: b) Depositing a layer of non-monocrystalline semiconductor material on a plane surface of a substrate of a monocrystalline semiconductor material; c) Incorporating inactivated dopant elements prior to step b) into said substrate () and/or, respectively, during or after step b) into said layer, so as to form an inactivated doped layer; d) Exposing, an external surface of the layer formed at step b) to a laser thermal anneal beam, so as to melt said layer down to the substrate and so as to activate said dopant elements incorporated at step c); e) Stopping exposure to the laser beam so as to induce epi-like crystallization of the melted layer, so that said substrate and/or, respectively, an epi-like monocrystalline semiconductor material, comprises a layer of activated doped monocrystalline semiconductor material.


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