The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Sep. 28, 2017
Applicant:

Taiyo Yuden Co., Ltd., Chuo-ku, Tokyo, JP;

Inventors:

Masuo Yatabe, Takasaki, JP;

Chitose Kimura, Takasaki, JP;

Kozue Imaizumi, Takasaki, JP;

Ichiro Yokoyama, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 2027/2809 (2013.01);
Abstract

In an embodiment, an electronic component includes: an element body partconstituted by an insulative body of rectangular solid shape; an internal conductorprovided inside the element body part; and external electrodesprovided at least on the bottom face(mounting surface) of the element body partand electrically connected to the internal conductor; wherein the element body parthas: a conductor-containing layerin which a coil conductor(functional part) that will become a part of the internal conductorto demonstrate electrical performance, is provided; and a high-hardness layerwhich is provided side by side with the conductor-containing layerin a direction parallel with the bottom face(mounting surface) of the element body part, and which has a higher hardness compared to the conductor-containing layer. The electronic component has improve mechanical strength.


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