The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Jan. 17, 2019
Applicants:

Sae Magnetics (H.k.) Ltd., Hong Kong, CN;

Headway Technologies, Inc., Milpitas, CA (US);

Inventors:

Takashi Honda, Hong Kong, CN;

Ryo Hosoi, Hong Kong, CN;

Wah Chun Chan, Hong Kong, CN;

Makoto Kawato, Hong Kong, CN;

Dayu Zhou, Milpitas, CA (US);

Koji Shimazawa, Milpitas, CA (US);

Kowang Liu, Milpitas, CA (US);

Assignees:

SAE MAGNETICS (H.K.) LTD., Hong Kong, CN;

HEADWAY TECHNOLOGIES, INC., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 11/105 (2006.01); G11B 5/012 (2006.01); G11B 5/00 (2006.01); G11B 5/31 (2006.01); G11B 5/60 (2006.01);
U.S. Cl.
CPC ...
G11B 5/012 (2013.01); G11B 5/314 (2013.01); G11B 5/6088 (2013.01); G11B 2005/0021 (2013.01);
Abstract

A light source unit for thermally-assisted magnetic head includes a substrate member having a bonding surface, multiple layers formed on the bonding surface and comprising a base layer, a connection pad layer, an insulation layer and a bonding layer; a light source assembly attached on the bonding layer of the substrate member and having a laser diode embedded therein and connected to the connection pad layer on the bonding surface, so as to form a laser diode circuit; and a heater buried in the insulation layer and connected to the connection pad layer, so as to form a heater circuit. The light source unit can maintain stable heat power for facilitating performance of the thermally-assisted magnetic head, and further reduce the sizes of the light source unit and substrate member.


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