The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

May. 24, 2018
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yuanzheng Guo, Beijing, CN;

Mingche Hsieh, Beijing, CN;

Ping Song, Beijing, CN;

Youwei Wang, Beijing, CN;

Weinan Dai, Beijing, CN;

Mingwen Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/24 (2006.01); G09F 9/30 (2006.01); H01L 51/00 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
G09F 9/301 (2013.01); H01L 51/0097 (2013.01); G06F 1/1652 (2013.01);
Abstract

There are provided a PI substrate, a preparation method thereof and a display device. The preparation method includes: forming a first separable film at an edge region of a substrate; forming a first-layer polyamic acid (PAA) film on the first separable film and the substrate; stripping the first separable film and the first-layer PAA film that covers the first separable film to expose the edge region of the substrate; and performing imidization on the first-layer PAA film on the substrate with the edge region exposed, to enable the first-layer PAA film to be transformed into a first-layer PI film, thereby avoiding uneven film thicknesses at edges of the first-layer PI substrates.


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