The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Apr. 17, 2018
Applicant:

China University of Mining and Technology, Beijing, Beijing, CN;

Inventors:

Yang Ju, Beijing, CN;

Peng Liu, Beijing, CN;

Hongbin Liu, Beijing, CN;

Yongming Yang, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 3/00 (2006.01); G01N 3/12 (2006.01); G06T 17/05 (2011.01); E21B 43/16 (2006.01); E21B 49/00 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
G01N 3/12 (2013.01); E21B 43/164 (2013.01); E21B 49/006 (2013.01); G06T 17/05 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); G01N 2203/0044 (2013.01); G01N 2203/0066 (2013.01); G01N 2203/0246 (2013.01); G01N 2203/0256 (2013.01);
Abstract

A method for measuring a stress field evolution during a COfracturing process is provided, which is adopted to not only transparently display the spatial distribution and propagation morphology of internal fracturing fracture of a three-dimensional physical models, but also obtain internal three-dimensional stress phase diagram in a fracture propagation process by integration of a CT scanning, a digital reconstruction, a 3D printing, a COfracturing experiment, a stress freezing and a photoelastic measurement techniques, thereby realizing transparent display and quantitative characterization of the three-dimensional stress field and its evolution law of a solid matter in the COfracturing process.


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